MediaTek Dimensity 7000 SOC key features hinted, could be released soon
A couple of weeks ago, MediaTek unveiled its latest flagship processor Dimensity 9000 based on a 4nm process to take on the new Snapdragon SoC launching this week. Now it looks like the company is gearing up to announce a new budget chipset that sits below the flagship SoC.
The Mali-G510 is the successor to the Mail G57 found on phones like the Realme X7, Poco M4 Pro and more. According to Arm, the Mali-G510 is expected to improve performance by 100% and be 22% more energy efficient compared to the Mali G57.
For context, the recently released Dimensity 9000 comes with one main X2 core clocked at 3.05GHz, as well as three performance Cortex-A710 cores clocked at 2.85GHz and four efficient cores clocked at 1.8GHz. The 10-core Mali-710 GPU is responsible for graphics and gaming performance.
As for the initial leaks, it looks like the MediaTek Dimensity 7000 processor will be used in more budget devices, and more specifically, it will be a 5G-enabled SOC like the rest of the Dims density line. A recent leak reveals that the upcoming Redmi K50 series or the upcoming Redmi phone is expected to feature the Dimensity 7000 processor.
MediaTek is holding an event in China on December 16 to officially launch Dims density 9000 in that country. While we’re not 100% sure at the moment, the upcoming one could announce Dims density 7000 on the same stage, or at least shed some information about the brand’s upcoming budget 5G chipset.
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